An automated co-sputtering source is capable of depositing films with a wide range of stoichiometry in-situ without the need for many different target formulations. The four … - Download [PDF]
An automated co-sputtering source is capable of depositing films with a wide range of stoichiometry in-situ without the need for many different target formulations. The four …
A sputtering target is a dense material composed of the compounds or pure elements manufacturers need in their thin-film coatings. Sputtering targets can vary in shape from …
Sputtering targets are used to produce low-radiation coated glass – also known as Low-E glass – which is commonly used in building construction because of its ability to save …
D.C. sputter deposition: Only for conducting materials. if DC sputtering were used for insulator. e.g. carbon, charge would accumulate at each electrode and quench plasma within 1 - 10 mico …
Advantages: the diversity of sputtering targets shapes (circular, rectangular, delta, tubular,…) and the use of various materials allow to create all kinds of thin films, even alloys within the same run. Sputtering offers good adherence and …
This study reports the first fully additively manufactured capacitors as a proof-of-concept demonstration of direct-write, ultrathin-film electronic components made via multi-material microplasma sputtering. This is also the first demonstration …
In this work, TiNx thin films were deposited by direct current (DC) reactive sputtering in a nitrogen and argon ambient using a titanium target. Upon systematically …
Sputtering is the process of ejecting surface atoms of a solid target material that shift from their solid phase to their gas phase after it has been bombarded with energetic …
Sputtering targets are used to deposit thin films of metals, such as platinum, palladium, or iridium, or oxides, such as tantalum oxide, or niobium oxide, which are used as electrodes or capacitors in microelectromechanical systems (MEMS) or nanoelectromechanical systems …
Sputtering is a technology used to form a thin film on a silicon wafer, glass, or other substrate. Within a vacuum state maintained in a sputtering machine, a sputtering target is bombarded with argon ions. This causes atoms or …